Kulicke and Soffa Industries, Inc. (NASDAQ:KLIC) Q3 2024 Earnings Call August 7, 2024 4:30 PM ET
Company Participants
Joe Elgindy - Director, Investor Relations
Fusen Chen - President and Chief Executive Officer
Lester Wong - Chief Financial Officer
Conference Call Participants
Craig Ellis - B. Riley Securities
Krish Sankar - TD Cowen
Tom Diffely - D.A. Davidson
Dave Duley - Steelhead Securities
Ross Cole - Needham & Company
Christian Schwab - Craig-Hallum Capital Group
Operator
Greetings and welcome to the Kulicke & Soffa 2024 Third Quarter Results. [Operator Instructions] As a reminder, this conference is being recorded. It is now my pleasure to introduce your host, Joe Elgindy, Director of Investor Relations. Thank you, Joe. You may begin.
Joe Elgindy
Thank you. Welcome everyone to Kulicke & Soffa’s fiscal third quarter 2024 conference call. Fusen Chen, President and Chief Executive Officer; and Lester Wong, Chief Financial Officer, are also joining on today’s call.
Non-GAAP financial measures referenced today should be considered in addition to, not as a substitute for or in isolation from our GAAP financial information. GAAP to non-GAAP reconciliation tables are included within our latest earnings release and earnings presentation. Both are available at investor.kns.com, along with prepared remarks for today’s call.
In addition to historical statements, today’s remarks will contain statements relating to future events and our future results. These statements are forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 and are subject to risks and uncertainties that may cause our actual results and financial condition to differ materially from the statements made today. For a complete discussion of the risks associated with Kulicke & Soffa that could affect our future results and financial condition, please refer to our recent and upcoming SEC filings, specifically our latest Form 10-K as well as the 8-K filed today.
With that said, I’ll now turn the call over to Fusen Chen for the business overview. Please go ahead.
Fusen Chen
Thank you, Joe. Good afternoon, everyone. Throughout the past quarters, we continued to execute on several growth initiatives, including driving critical progress in Advanced Packaging and Advanced Dispense qualifications, enjoying broadening adoption of our new ball bonding solutions, while we also observed ongoing utilization improvements across several of our key end markets.
Before reviewing our quarterly results and performance, I would like to mention a few points on the recent industry momentum within Thermocompression. There have been three key milestones which we are excited to explain. First, the formation of, as well as our membership in, the U.S.-Joint semiconductor consortium was announced last month. Resonac Holdings Corporation, a leading provider of global semiconductor materials, formed this consortium to support industry collaboration and market adoption of new advanced packaging production solutions. After Joint and Joint 2 were created in Japan, the U.S.-Joint consortium represents the third Joint consortium globally and the first in the United States.